Chunghyun Park


I am a Ph.D. student at POSTECH where I am advised by Prof. Minsu Cho and a member of the Computer Vision Lab. Previously, I completed my M.S. in Artificial Intelligence and B.S. in Mechanical Engineering at POSTECH.

My research lies in machine learning and computer vision including, but not limited to, 3D scene understanding and reconstruction. I am particularly interested in 3D perception on point clouds for applications in AR/VR and robotics.

If you are interested in my research projects, please feel free to contact me.


Feb 27, 2024 :pencil: A paper about 3D semantic correspondence is accepted to CVPR 2024.
Dec 11, 2023 I joined NVIDIA Research Taiwan as a research intern.
Nov 2, 2023 :microphone: I gave a spotlight talk at Korea AI Summit 2023.
Apr 25, 2023 :pencil: A paper about equivariant learning is accepted to ICML 2023.
Feb 27, 2023 :trophy: I won the grand prize at BK21 Best Paper Award from POSTECH GSAI.

Selected Publications

* indicates equal contribution.

  1. Learning SO(3)-Invariant Semantic Correspondence via Local Shape Transform
    Chunghyun Park*Seungwook Kim*Jaesik Park, and Minsu Cho
    IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), 2024
  2. Stable and Consistent Prediction of 3D Characteristic Orientation via Invariant Residual Learning
    Seungwook Kim*Chunghyun Park*Yoonwoo JeongJaesik Park, and Minsu Cho
    International Conference on Machine Learning (ICML), 2023
  3. SeLCA: Self-Supervised Learning of Canonical Axis
    Seungwook Kim*Yoonwoo Jeong*Chunghyun Park*Jaesik Park, and Minsu Cho
    NeurIPS Workshop on Symmetry and Geometry in Neural Representations, 2022
  4. PointMixer: MLP-Mixer for Point Cloud Understanding
    Jaesung Choe*Chunghyun Park*Francois RameauJaesik Park, and In So Kweon
    European Conference on Computer Vision (ECCV), 2022
  5. Fast Point Transformer
    Chunghyun ParkYoonwoo JeongMinsu Cho, and Jaesik Park
    IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), 2022
    Silver Prize @ Samsung HumanTech Paper Award
    Qualcomm Innovation Fellowship Winner